Encapsulated organic electronic devices and method for...

Electric lamp and discharge devices – With luminescent solid or liquid material – Solid-state type

Reexamination Certificate

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Details

C313S506000, C313S512000, C257S086000, C257S094000, C257S040000

Reexamination Certificate

active

06867539

ABSTRACT:
Encapsulated organic electronic devices including organic light emitting diodes are made using an adhesive component as a mask while the device is being constructed. An adhesive-coated liner can be applied to the device substrate and openings created therein by removing portions of the linear and adhesive, or a patterned adhesive layer having openings therein can be formed on the device substrate, followed by deposition of the device layers and application of a sealing layer.

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Article: Affinito et al., “PML/Oxide/PML Barrier Layer Performance Differences Arising From Use of UV or Electron Beam Polymerization of the PML Layers,”Thin Solid Films, 308-309, 1997, pp. 19-25.

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