Encapsulated optical package

Details Encapsulated optical package Encapsulated optical package

2004-07-26

2010-10-26

Nguyen, Ha Tran T (Department: 2829)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Including integrally formed optical element

C385S088000, C385S089000, C385S094000

Reexamination Certificate

active

07820462

ABSTRACT:
A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic chip and the translucent coating substance is then polished away to enable an optical coupling.

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