Encapsulated nickel photoreceptor substrate

Electrolysis: processes – compositions used therein – and methods – Electroforming or composition therefor – Sheet – web – wire – or filament

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Details

205 78, 205 67, C25D 100

Patent

active

056814402

ABSTRACT:
An electroforming process and apparatus for creating a nickel or like substrate encapsulated by another material to prevent wear to the nickel substrate. The encapsulation of the nickel substrate requires encapsulation of the inner and outer diameter of the nickel substrate. The encapsulating material must adhere to the nickel substrate. Encapsulation of the nickel substrate prevents exposure of the nickel and thus avoids the hazardous nickel dust particles that can occur when the nickel is exposed.

REFERENCES:
patent: 4462873 (1984-07-01), Watanabe
patent: 4664758 (1987-05-01), Grey
patent: 4902386 (1990-02-01), Herbert et al.
patent: 5196106 (1993-03-01), Dupree et al.

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