Encapsulated microcircuit package and method for assembly thereo

Details Encapsulated microcircuit package and method for assembly thereo Encapsulated microcircuit package and method for assembly thereo

1975-02-21

1977-03-15

Truhe, J. V.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29627, 174 52FP, H05K 500

Patent

active

040125793

ABSTRACT:
A microcircuit deposited on a substrate is encapsulated within a housing having bottom and top cover portions. The substrate initially is adhesively secured to the bottom cover portion. The bottom and top cover portions then are placed into engagement, the assembled housing containing the substrate is cured, and a potting compound is injected into, and allowed to solidify between, the cover portions to encapsulate the microcircuit.

REFERENCES:
patent: 3265806 (1966-08-01), Burks et al.
patent: 3354394 (1967-11-01), James
patent: 3370203 (1968-02-01), Kravitz et al.
patent: 3469684 (1969-09-01), Keady et al.
patent: 3668299 (1972-06-01), McNeal

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