Encapsulated materials

Details Encapsulated materials Encapsulated materials

1995-02-17

1999-08-03

Kiliman, Leszek

Coating processes

Particles, flakes, or granules coated or encapsulated

Solid encapsulation process utilizing an emulsion or...

42721332, 42721333, 42721336, 428522, 4284022, 42840221, 42840222, 264 46, 264 433, B01J 1302, B05D 700

Patent

active

059322853

ABSTRACT:
Methods and compositions for encapsulated polymeric gels swollen with nonaqueous reactive materials are provided. The methods include gel synthesis, swelling of a gel precursor with a first nonaqueous reactive material, and encapsulation of the swollen gel with a second nonaqueous reactive material. Gels precursors may be synthesized from crosslinking polymers, or alternatively, may be formed by crosslinking and polymerizing a monomer starting material. An accelerator may be utilized to facilitate swelling of the gel precursor with the first nonaqueous reactive material. Foams and composites may also be swollen with the first nonaqueous reactive material. The swollen gel is then contacted with a second nonaqueous reactive material such that an encapsulation layer is formed thereby. The encapsulated gels may be stored for subsequent use. The methods further include release of the first nonaqueous reactive material encapsulated within the gel under conditions which compromise the integrity of the encapsulation layer. The released first nonaqueous reactive material is then reacted with a nonaqueous reactive material, the reaction product being a useful product for a variety of applications such as coatings, adhesives, sealings, caulking, laminating materials, electrical coatings and the like.

REFERENCES:
patent: 3179716 (1965-04-01), Bruin et al.
patent: 3405070 (1968-10-01), Reyes et al.
patent: 3409461 (1968-11-01), Mehlo et al.
patent: 3494872 (1970-02-01), Materson et al.
patent: 3540914 (1970-11-01), Lin
patent: 3551346 (1970-12-01), Breen et al.
patent: 3565818 (1971-02-01), Bayless et al.
patent: 3607775 (1971-09-01), Yoshlda et al.
patent: 3627581 (1971-12-01), Phillips
patent: 3639259 (1972-02-01), Scarpelli
patent: 3654314 (1972-04-01), Farber et al.
patent: 3672935 (1972-06-01), Miller et al.
patent: 3703397 (1972-11-01), Lin et al.
patent: 3860565 (1975-01-01), Barber, Jr.
patent: 3865726 (1975-02-01), Chibata et al.
patent: 3932361 (1976-01-01), Russell et al.
patent: 3939105 (1976-02-01), Jones, Jr. et al.
patent: 3939123 (1976-02-01), Matthews et al.
patent: 3954678 (1976-05-01), Marquisee
patent: 4020005 (1977-04-01), Lang
patent: 4035467 (1977-07-01), Campbell et al.
patent: 4046741 (1977-09-01), Scher
patent: 4093674 (1978-06-01), Tsutsui et al.
patent: 4100148 (1978-07-01), Hockenberger et al.
patent: 4140516 (1979-02-01), Scher
patent: 4155741 (1979-05-01), Scher et al.
patent: 4165102 (1979-08-01), Bodmer
patent: 4209605 (1980-06-01), Hoy
patent: 4224422 (1980-09-01), Rude et al.
patent: 4355130 (1982-10-01), Heinze
patent: 4413069 (1983-11-01), Marshall
patent: 4439488 (1984-03-01), Trimnell et al.
patent: 4461854 (1984-07-01), Smith
patent: 4483974 (1984-11-01), Grogler et al.
patent: 4525570 (1985-06-01), Blum et al.
patent: 4546165 (1985-10-01), Grogler et al.
patent: 4619985 (1986-10-01), Hess et al.
patent: 4644033 (1987-02-01), Gnanou
patent: 4666968 (1987-05-01), Downey et al.
patent: 4666969 (1987-05-01), Brauer et al.
patent: 4667008 (1987-05-01), Grogler et al.
patent: 4690786 (1987-09-01), Ninomiya et al.
patent: 4939190 (1990-07-01), Tomioka et al.
patent: 4999213 (1991-03-01), Meyer
patent: 5000955 (1991-03-01), Gould et al.
patent: 5089582 (1992-02-01), Lewis
patent: 5221713 (1993-06-01), Kempner et al.
patent: 5292829 (1994-03-01), Konno et al.
Bromberg et al., "Extraction Chromatography with Modified Poly(Vinyl Chloride) and Di(2-ethylhexyl) Dithiophosphoric Acid", Jour. of Chrom., 634, p.p. 183-196, 1993.

Affiliated with

Also associated with

Rating

Encapsulated materials does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Encapsulated materials, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Encapsulated materials will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-847758