Encapsulated light receiving and processing semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Reexamination Certificate

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Details

C257S431000, C257S432000, C257S434000, C257S666000, C257S690000, C257S701000, C257S723000, C257S724000, C257S787000

Reexamination Certificate

active

07071523

ABSTRACT:
A semiconductor module that includes a resin package having a first surface and a second surface which is different from the first surface. A lead includes an inner portion covered by the resin package and an outer portion projecting from the first surface of the resin package. A semiconductor element is mounted to the inner portion of the lead and is covered by the resin package. A conductive film, provided separately from the lead, covers at least the second surface of the resin package, with the conductive film provided with a connecting portion held in contact with the outer portion of the lead at the first surface of the resin package. The inner portion of the lead includes an extension extending toward the second surface of the resin package the extension being held in contact with the conductive film at the second surface of the resin package.

REFERENCES:
patent: 5291054 (1994-03-01), Tanaka et al.
patent: 6407381 (2002-06-01), Glenn et al.
patent: 6459130 (2002-10-01), Arndt et al.
patent: 6855886 (2005-02-01), Kawamura et al.
patent: 7-273356 (1995-10-01), None
patent: 07-273356 (1995-10-01), None

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