Encapsulated light emitting diodes

Details Encapsulated light emitting diodes Encapsulated light emitting diodes

1993-04-19

1995-05-09

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

257 98, 257432, 257667, 257687, 257787, H01L 3300, H01L 2714, H01L 2348, H01L 2302

Patent

active

054142938

ABSTRACT:
Encapsulation of semiconductor light emitting diodes, in particular laser diodes, characterized in that a gap is formed in an encapsulant, which is positioned in front of the light emitting facet of the diode, the gap preventing the encapsulant from adhering to the light emitting facet.

REFERENCES:
patent: 3786499 (1974-01-01), Jankowski et al.
patent: 4390810 (1983-06-01), Biwa
patent: 5052009 (1991-09-01), Tsuboi et al.
patent: 5250816 (1993-10-01), Kitamura
"UV-Aushartende Epoxies, Klebstoffe und Abdeckmassen" UK-Lichtquellen, Electro`Lite Corp., Polyscience AG, Bleichistrasse, Switzerland.
H. Kaufmann, et al., "Self-Adjusted Permanent Attachment of Fibres to GaAs Waveguide Components" Electronics Letters, vol. 22, No. 12, pp. 642-643 (Jun. 1986).

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