Encapsulated inductive devices with polybutadiene encapsulant

Details Encapsulated inductive devices with polybutadiene encapsulant Encapsulated inductive devices with polybutadiene encapsulant

1984-10-19

1986-06-17

Briggs, Sr., Wilbert J.

Stock material or miscellaneous articles

Sheet including cover or casing

428521, 428 76, 525264, 26427211, B29B 104, B29B 302, B29B 314

Patent

active

045956162

ABSTRACT:
Improved encapsulating compositions for inductive devices are provided. The composition has a polybutadiene base and contains an initiator, an inhibitor and a co-agent for improving the curing of the composition under the influence of the initiator.
Certain compositions are usable at higher temperatures than prior polybutadiene base encapsulating compounds based on a conditioning of the composition during cure at or near the projected use temperature. When combined with high temperature conductor insulation coatings, such as polyimides, a high temperature encapsulating system is achieved.
Certain compositions are usable to provide a soft cure encapsulation from which an encapsulated inductive device may be liberated without damage to the device. For such compositions, soft curable polybutadienes are employed and particularly those having high trans and cis components.

REFERENCES:
patent: 3488616 (1970-01-01), Duncan et al.
patent: 3751378 (1973-08-01), Cowperthwaite et al.
patent: 3970723 (1976-07-01), Mees et al.

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