Encapsulated implantable transponder

Details Encapsulated implantable transponder Encapsulated implantable transponder

1996-10-11

1999-10-05

Wu, Daniel J.

Communications: electrical

Condition responsive indicating system

Specific condition

128899, 257784, 343873, G08B 1314

Patent

active

059631325

ABSTRACT:
An EID or RFID transponder having an encapsulant with an open end to allow insertion of the transponder circuitry and a phase changing material such as an epoxy used to both secure the circuitry of the transponder within the encapsulant and seal the open end of the encapsulant.

REFERENCES:
patent: 4262632 (1981-04-01), Hanton et al.
patent: 4333072 (1982-06-01), Beigel
patent: 5025550 (1991-06-01), Zirbes et al.
patent: 5211129 (1993-05-01), Taylor et al.
patent: 5223851 (1993-06-01), Hadden et al.
patent: 5281855 (1994-01-01), Hadden et al.
patent: 5341149 (1994-08-01), Valimaa et al.
patent: 5482008 (1996-01-01), Stafford et al.
patent: 5572410 (1996-11-01), Gustafson
patent: 5634432 (1997-06-01), O'Grady et al.

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