Encapsulated hybrid circuit assembly

Details Encapsulated hybrid circuit assembly Encapsulated hybrid circuit assembly

1979-06-25

1981-08-04

James, Andrew J.

357 70, 357 75, 357 80, 357 81, H01L 2328, H01L 2316, H01L 2302

Patent

active

042825440

ABSTRACT:
A hybrid circuit including IC chips and discrete components wherein a substrate is connected to a lead frame and the lead frame is utilized for securing and positioning the substrate during the mounting and electrical connecting of IC chips and discrete components thereon. Once the entire circuit is connected the lead frame is utilized for securing and positioning the substrate in a transfer mold to encapsulate the substrate with epoxy or the like. In the present invention a pair of matching substrates having interconnected circuits thereon are constructed simultaneously and formed into two interconnected packages which can be tested before or after mounting in a receiving structure. Further, repairs may be made to the final assembly without destruction thereof, since the "component like" circuit package can be replaced without affecting other parts in the system.

REFERENCES:
patent: 3439255 (1969-04-01), Carnes et al.
patent: 3469148 (1969-09-01), Lund
patent: 3500440 (1970-03-01), Hastings
patent: 3544857 (1970-12-01), Byrne et al.
patent: 3793474 (1974-02-01), Dunn
patent: 3839660 (1974-10-01), Stryker
patent: 3958075 (1976-05-01), Kaufman
patent: 4066839 (1978-01-01), Cossutta et al.
patent: 4092487 (1978-05-01), Imai
patent: 4128801 (1978-12-01), Gansert et al.
RCA Technical notes; by Greig, Tune Stage Assembly Technique for Semiconductor Devices, Apr. 1968, pp. 1 and 2.
Hybrid Assembly Time Reduced With Purpose-Designed Chips; Electronics Engineering, by Jordan; Jun. 1972, pp.58-61.

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