Encapsulated electronic sensor package

Electricity: conductors and insulators – Boxes and housings – With electrical device

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C116S208000, C188S00111E, C361S752000

Reexamination Certificate

active

07126063

ABSTRACT:
An electronic package includes a circuit board and a capsule layer encasing the circuit board and forming an immersible electronic module. A housing receives the electronic module and forms a protective shell around the electronic module.

REFERENCES:
patent: 3256382 (1966-06-01), Johnson et al.
patent: 3806770 (1974-04-01), Voyles et al.
patent: 3909504 (1975-09-01), Browne
patent: 4223177 (1980-09-01), Nakamura
patent: 4528932 (1985-07-01), Ducza et al.
patent: 4694119 (1987-09-01), Groenewegen
patent: 4712420 (1987-12-01), Johansson et al.
patent: 4811168 (1989-03-01), Chesnut et al.
patent: 4944401 (1990-07-01), Groenewegen
patent: 5913385 (1999-06-01), Thibodeau
patent: 6030118 (2000-02-01), Schneider et al.
patent: 6783373 (2004-08-01), Hsu et al.
patent: 6872880 (2005-03-01), King et al.
patent: 6920050 (2005-07-01), Little et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Encapsulated electronic sensor package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Encapsulated electronic sensor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Encapsulated electronic sensor package will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3616646

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.