Encapsulated electronic devices and encapsulating compositions

Details Encapsulated electronic devices and encapsulating compositions Encapsulated electronic devices and encapsulating compositions

1981-01-05

1982-05-18

Michl, Paul R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

174 52PE, 26024591, 26427211, 524863, 524 90, C08K 534

Patent

active

043306373

ABSTRACT:
An electronic device such as an integrated circuit is encapsulated within a silicone resin formulation having a metallo-porphyrin compound contained therein. The compound is cleaved by HCl to form a porphyrin diacid chloride and a free metal having the capability of chelating chloride ions and hydroxyl groups thereby preventing corrosion and anionic attack of metallic circuit elements and development of unwanted conductive pathways.

REFERENCES:
patent: 3137665 (1964-06-01), Retford
patent: 3689454 (1972-09-01), Smith
patent: 3965065 (1976-06-01), Elliott
A. Kaneda, Chem. Abs. 85:39929q, Mar. 1976.
Wong, J., Am. Chem. Soc., vol. 96, pp. 7149-7150 (1974).
Wong, Tetrahedron Letters, No. 31, pp. 2637-2640 (1975).
Martarano, J., Physical Chemistry, vol. 80, No. 21, pp. 2389-2393 (1976).
Horrocks, J. American Society, vol. 98, pp. 7157-7162 (Nov. 1976).

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