Encapsulated electronic components and encapsulation composition

Details Encapsulated electronic components and encapsulation composition Encapsulated electronic components and encapsulation composition

1982-12-28

1985-04-30

Lilling, Herbert J.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

26427211, 26427216, 26427217, 26427218, 524261, 524423, 524451, 524456, 524505, 361331, 525 90, 525189, 525901, B29C 600, C08L 9100

Patent

active

045145881

ABSTRACT:
Electronic components are encapsulated with a poly(arylene sulfide) composition containing hydrogenated conjugated diene/monovinyl-substituted aromatic copolymer. The invention also includes certain encapsulation compositions containing poly(arylene sulfide), hydrogenated conjugated diene/monovinyl-substituted aromatic copolymer, reinforcement and filler.

REFERENCES:
patent: 4309514 (1982-01-01), Lee
patent: 4322507 (1982-03-01), Haaf
patent: 4332590 (1982-06-01), Smith
patent: 4337182 (1982-06-01), Needham
patent: 4370292 (1983-01-01), Yanase et al.
patent: 4436865 (1984-03-01), Beever
Derwent Abst. 82546 E/39 (J57135859) 8-1982.
Derwent Abst. 20580 (J57021844) 2-1982.
Derwent Abst. 42553 K/18 (J58049749) 3-1983.
Derwent Abst. 52624 K/22 (J58067752) 4-1983.
Derwent Abst. 29924 E/15 (J57040557) 3-1982.

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