Encapsulated electronic component having a heat diffusing layer

Details Encapsulated electronic component having a heat diffusing layer Encapsulated electronic component having a heat diffusing layer

1993-07-06

1995-01-03

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 522, 257790, H05K 720

Patent

active

053791860

ABSTRACT:
An encapsulated electronic component having an integral heat diffuser. The heat producing electronic component (10) is mounted on a substrate carrier (12) and a layer of encapsulant material (16) covers the component. A layer of thermally conductive material (18) is applied over the encapsulant material, and then a second layer of encapsulant material (20) is applied over the thermally conductive material. The heat generated by the component is distributed throughout the thermally conductive material, thereby eliminating the hot spot over the component, resulting in a substantially lower surface temperature.

REFERENCES:
patent: 4768081 (1988-08-01), Moeller
patent: 4843520 (1989-06-01), Nakatani et al.
patent: 4970579 (1990-11-01), Arldt et al.
patent: 4974057 (1990-11-01), Tazima
patent: 5045914 (1991-09-01), Casto et al.

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