Encapsulated electronic component and method for encapsulating a

Details Encapsulated electronic component and method for encapsulating a Encapsulated electronic component and method for encapsulating a

1996-02-08

1997-12-23

Kincaid, Kristine L.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174 522, 361765, 29841, 257787, H05K 100

Patent

active

057009813

ABSTRACT:
A method for encapsulating an electronic component includes providing a substrate; providing an enclosure dam around at least a portion of electronic component placed relative to the substrate; providing a first substantially uncured flowable encapsulation material outwardly of the electronic component and within the enclosure dam; providing a second encapsulation material atop the first encapsulation material and within the enclosure dam; and curing the first encapsulation material into a substantially non-flowable state, the second encapsulation material and the enclosure dam retaining the first flowable encapsulation material relative to the electronic component and substrate during the curing, the cured first material and the second material collectively forming a resultant encapsulation body on the electronic component. An encapsulated body having the above attributes is also disclosed.

REFERENCES:
patent: 4122211 (1978-10-01), Kikuga et al.
patent: 5422514 (1995-06-01), Griswold et al.
patent: 5528457 (1996-06-01), Hawke et al.
patent: 5547730 (1996-08-01), Weiblen et al.
patent: 5600181 (1997-02-01), Scott et al.
IBM Technical Disclosures, vol. 11, No. 8, Cameron and Finch, p. 971, Jan. 1969.

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