Electricity: conductors and insulators – Feedthrough or bushing – Compression
Patent
1984-05-23
1987-07-14
Edlow, Martin H.
Electricity: conductors and insulators
Feedthrough or bushing
Compression
357 80, 357 70, 357 84, 357 74, 174 52FP, H01L 2328, H01L 3902, H01L 2348, H01L 2504
Patent
active
046806172
ABSTRACT:
Encapsulated electronic circuit devices as well as methods and molding apparatus for making same are disclosed. For example, an integrated circuit "die" (or "chip") and the lead frame (or frames) to which it is physically affixed and electrically connected are positioned in a mold between stacks of resin impregnated fibrous layers of predetermined shape and size. The layers are then compressed under heat and pressure causing them to fuse together about the die and its lead frame(s). This forms a laminated protective sealed encapsulation for the die and adjacent portions of the lead frame(s), without causing undue damage to the delicate lead wires electrically connecting the die to the lead frame. Such multiple laminated layers of resin and fibers, which preferably include woven glass cloth or similar materials, provide a strong, resilient integrated circuit chip "carrier" (of either the "leaded" or "leadless" variety) which may conveniently include multiple lead frames, heat conductive members, strengthening members and the like.
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Edlow Martin H.
Limanek Robert P.
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