Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-04-21
2009-06-09
Pert, Evan (Department: 2826)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S121000, C438S124000
Reexamination Certificate
active
07544540
ABSTRACT:
A micro-electro-mechanical systems (MEMS) component includes a panel, a chip having an underside containing active component structures, where the chip is mounted on the panel via bumps, a frame structure on the panel and enclosing an installation site of the chip, and a jet-printed structure closing a seam between frame structure and chip. The jet-printed structure has an upper edge that is above a lower edge of the chip.
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Bauer Christian
Krueger Hans
Stelzl Alois
Ahmed Selim
EPCOS AG
Fish & Richardson P.C.
Pert Evan
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