Encapsulated contact material and a manufacturing method therefo

Details Encapsulated contact material and a manufacturing method therefo Encapsulated contact material and a manufacturing method therefo

1996-02-05

1999-04-06

Donovan, Lincoln

Electricity: magnetically operated switches, magnets, and electr

Electromagnetically actuated switches

Vacuum or hermetically sealed type

335 58, 427165, H01L 166

Patent

active

058924248

ABSTRACT:
In an encapsulated contact material which varies little in contact resistance and has good working life performance, at least one contact coating layer is formed covering the surface of a contact substrate. The contact coating layer includes a substantial matrix formed of at least one element selected from a group including Mo, Zr, Nb, Hf, Ta, and W, the matrix being loaded with 0.5 to 50 atom % of at least one element selected from a group including Zn, Cd, Hg, Al, Ga, In, Tl, Ge, Sn, Pb, As, Sb, and Bi. The contact coating layer has a thickness of 0.1 .mu.m or more.

REFERENCES:
patent: 3873902 (1975-03-01), Burch
patent: 4348566 (1982-09-01), Baba et al.
patent: 5594400 (1997-01-01), King

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