Encapsulated component which is small in terms of height and...

Details Encapsulated component which is small in terms of height and... Encapsulated component which is small in terms of height and...

2006-01-03

2006-01-03

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

C174S050510, C257S787000, C257S738000, C257S778000

Reexamination Certificate

active

06982380

ABSTRACT:
For simpler and safer encapsulation of components, it is proposed to generate the connection between a chip and a carrier substrate by means of bump connections that are sunk into recesses on the carrier substrate. The component thereby lies directly on the carrier substrate, in particular on a frame circumscribing the component structures on the chip.

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Selmeier et al, “Recent Advances in SAW Packaging”,IEEE Ultrasonics Symposium, Oct. 7-10, 2001, pp. 283-292.

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