Encapsulated circuitized power core alignment and lamination

Details Encapsulated circuitized power core alignment and lamination Encapsulated circuitized power core alignment and lamination

1992-03-31

1993-07-20

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

361414, H05K 100

Patent

active

052295508

ABSTRACT:
A structure and method are disclosed for making high density circuit board. Using photosensitive or other dielectric materials over a circuitized power core, vias and lands are opened up, filled with joining metal and aligned with the next level, eliminating a major registration problem in building up a high density composite and reducing the number of steps in the manufacturing process.

REFERENCES:
patent: 4685033 (1987-08-01), Inoue
patent: 4721831 (1988-01-01), Vora
patent: 4774632 (1988-09-01), Neugebauer
patent: 4783722 (1988-11-01), Osaki et al.
patent: 4803595 (1989-02-01), Kraus et al.
patent: 4886699 (1989-12-01), Carroll et al.
patent: 4916260 (1990-04-01), Broaddus et al.
patent: 5072075 (1991-12-01), Lee et al.
patent: 5077115 (1991-12-01), Arthur et al.

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