Encapsulated, board-mountable power supply and method of manufac

Details Encapsulated, board-mountable power supply and method of manufac Encapsulated, board-mountable power supply and method of manufac

1996-12-23

1998-11-10

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361705, 361707, 361712, 361717, 361718, 361719, 361736, 361752, 257712, 257717, 257787, 257796, 165 802, 336200, 363141, H05K 720

Patent

active

058353500

ABSTRACT:
A power supply and a method of manufacture therefor. The power supply includes a circuit board containing conductors for interconnecting electrical components of the power supply and a thermally-conductive case having an integral electrically insulating layer. The thermally-conductive case forms a reservoir to receive the circuit board therein. The power supply further includes a power semiconductor device having a body connected in thermal communication with the thermally-conductive case and terminals coupled to the conductors of the circuit board. The power supply still further includes an encapsulant, located within the reservoir, capable of ensconcing the power semiconductor device and the electrical components. Additionally, electrical leads extend from the power supply that allow the power supply to be coupled to a printed wiring board.

REFERENCES:
patent: 4899256 (1990-02-01), Sway-Tin
patent: 5075821 (1991-12-01), McDonnal
patent: 5384683 (1995-01-01), Tsunoda
patent: 5610799 (1997-03-01), Kato
patent: 5642276 (1997-06-01), Lotfi et al.
patent: 5659462 (1997-08-01), Chen et al.
Publication from ISHM '95 Proceedings entitled "A New Leadframeless IC Carrier Package Using Metal Base Substrate" pp. 348-352 Authors: Junsuke Tanaka, Kunihiro Nagamine, Toshiharu Koike, Seiichi Takahashi.

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