Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-07-30
1999-07-20
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361705, 361707, 361712, 361717, 361718, 361719, 361736, 361752, 257712, 257717, 257787, 257796, 165 802, 336200, 363141, H05K 720
Patent
active
059263733
ABSTRACT:
A power supply and a method of manufacture therefor. The power supply includes: (1) a circuit board containing conductors for interconnecting electrical components of the power supply, (2) a thermally-conductive case having an integral electrically insulating layer, the thermally-conductive case forming a reservoir to receive the circuit board therein, (3) a power semiconductor device having a body connected in thermal communication with the thermally-conductive case and terminals coupled to the conductors of the circuit board, (4) an encapsulant, located within the reservoir, the encapsulant ensconcing the power semiconductor device and the electrical components and (5) electrical leads extending from the power supply that allow the power supply to be coupled to a printed wiring board.
REFERENCES:
patent: 4899256 (1990-02-01), Sway-Tin
patent: 5051869 (1991-09-01), Goldfarb
patent: 5060113 (1991-10-01), Jacobs
patent: 5075821 (1991-12-01), McDonnal
patent: 5375040 (1994-12-01), Cooper et al.
patent: 5384683 (1995-01-01), Tsunoda
patent: 5610799 (1997-03-01), Kato
patent: 5642276 (1997-06-01), Lotfi et al.
patent: 5646827 (1997-07-01), Hirao et al.
patent: 5659462 (1997-08-01), Chen et al.
patent: 5703754 (1997-12-01), Hinze
Publication from ISHM '95 Proceedings entitled "A New Leadframeless IC Carrier Package Using Metal Base Substrate" pp. 348-352. Authors: Junsuke Tanaka, Kunihiro Nagamine, Toshiharu Koike, Seiichi Takahashi.
Chervinsky Boris L.
Lucent Technologies - Inc.
Picard Leo P.
LandOfFree
Encapsulated, board-mountable power supply and method of manufac does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Encapsulated, board-mountable power supply and method of manufac, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Encapsulated, board-mountable power supply and method of manufac will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1327817