Encapsulated barrier for flexible films and a method of...

Details Encapsulated barrier for flexible films and a method of... Encapsulated barrier for flexible films and a method of...

2005-06-28

2005-06-28

Tarazano, D. Lawrence (Department: 1773)

Stock material or miscellaneous articles

Sheet including cover or casing

Complete cover or casing

C428S520000, C428S475800, C428S910000, C428S036700

Reexamination Certificate

active

06911244

ABSTRACT:
The present invention relates to a film structure and a method of manufacturing the same. More specifically, the film structure may include a barrier material made from EVOH, nylon or other thermally sensitive barrier material encapsulated by a first adhesive material. The barrier material and the first adhesive material form a barrier layer and a first set of adhesive layers when coextruded. The barrier layer and the first set of adhesive layers may be coextruded at the same or a similar temperature to form a first extrudate. The extrudate may be encapsulated by or otherwise coextruded with a second adhesive material to form a second extrudate at a higher temperature than the first extrudate that then may be formed into a flat sheet via a die. The first set of adhesive layers protects the barrier layer from high temperatures and long residence times related to the coextrusion/lamination process that may degrade the barrier layer. In addition, acid terpolymer consisting of ethylene/methyl acrylate/acrylic acid adheres a barrier material of EVOH to outer layers of the film structure.

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Supplementary European Search Report for EP Patent Application No. 01964456.6 dated May 18, 2004.

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