Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From phenol – phenol ether – or inorganic phenolate
Reexamination Certificate
2006-05-09
2006-05-09
Dawson, Robert (Department: 1712)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
From phenol, phenol ether, or inorganic phenolate
C428S413000
Reexamination Certificate
active
07041771
ABSTRACT:
Encapsulated electrical component assemblies and methods of electrically connecting an electrical component having a plurality of component electrical terminations to a component carrying substrate having a plurality of substrate electrical terminations at surface mount reflow soldering conditions is described. The electrical and substrate components have an encapsulant-forming composition sandwiched therebetween and encasing said pluralities of component and substrate electrical connections. The described invention relates to using an encapsulant-forming composition comprising a thermosetting resin (preferably an epoxy resin) and a cross-linking agent (preferably an anhdride) for said resin that cross-links said resin and that also acts as a fluxing agent and optionally includes a catalyst for initiating cross-linking at required conditions. The gel point of the encapsulant-forming composition is reached after solder melt.
REFERENCES:
patent: 3449641 (1969-06-01), Lee
patent: 3791027 (1974-02-01), Angelo et al.
patent: 3939488 (1976-02-01), Wakashima et al.
patent: 4091048 (1978-05-01), Labana et al.
patent: 4282136 (1981-08-01), Hunt et al.
patent: 4356505 (1982-10-01), Lovinger et al.
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4642321 (1987-02-01), Schoenberg et al.
patent: 4855001 (1989-08-01), Damico et al.
patent: 4980086 (1990-12-01), Hiraiwa et al.
patent: 4999699 (1991-03-01), Christie et al.
patent: 5107327 (1992-04-01), Nishimori et al.
patent: 5117279 (1992-05-01), Karpman
patent: 5128746 (1992-07-01), Pennisi et al.
patent: 5136365 (1992-08-01), Pennisi et al.
patent: 5250848 (1993-10-01), Christie et al.
patent: 5269453 (1993-12-01), Melton et al.
patent: 5376403 (1994-12-01), Capote et al.
patent: 5418266 (1995-05-01), Shiobara et al.
patent: 5439164 (1995-08-01), Hasegawa et al.
patent: 9306943 (1993-04-01), None
Grace O'Malley et al., “The Importance of Material Selection for Flip Chip on Board Assemblies,” IEEE Transactions on Components, Packaging, and Manufacturing Technology—Part B, vol. 17, No. 3, Aug. 1994.
E. Jan Vardaman, “International Activities in Flip Chip on Board Technologies,” pp. 946-949.
Dawson Robert
Drehkoff W. Dennis
KAC Holdings, Inc.
Ryndak & Suri LLP
LandOfFree
Encapsulant with fluxing properties and method of use in... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Encapsulant with fluxing properties and method of use in..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Encapsulant with fluxing properties and method of use in... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3541480