Encapsulant of epoxy group-containing (meth)acrylic polymer,...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C524S558000

Reexamination Certificate

active

07919550

ABSTRACT:
A photosemiconductor encapsulating resin composition, excellent in light transmittance, ultraviolet resistance and heat resistance, comprising the following component (A) and component (B):(A): a (meth)acrylic polymer containing an epoxy group, and(B): at least one hardener selected from the group consisting of the following components (b1) to (b4)(b1) a polyvalent carboxylic acid,(b2) a polyvalent carboxylic anhydride,(b3) a reaction product of a polyvalent carboxylic acid with a compound of the following general formula (B-1), and(b4) a reaction product of a polyvalent carboxylic anhydride with a compound of the following general formula (B-2)wherein R1to R6represent each independently a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, R3and R4may be bonded to form an alkylene group having 1 to 8 carbon atoms; R7represents an alkylene group; a methylene group contained the alkylene group and the alkyl group represented by R1to R7may be substituted by an ether group and/or carbonyl group; Y1and Y2represent each independently an oxygen atom, or sulfur atom, is provided.

REFERENCES:
patent: 2768153 (1956-10-01), Shokal
patent: 4091048 (1978-05-01), Labana et al.
patent: 4931509 (1990-06-01), Yagishita et al.
patent: 5214104 (1993-05-01), Wamprecht et al.
patent: 5601878 (1997-02-01), Kranig et al.
patent: 5719212 (1998-02-01), Nakae et al.
patent: 7034075 (2006-04-01), Torborg et al.
patent: 7423083 (2008-09-01), Kawaguchi et al.
patent: 0789064 (1997-08-01), None
patent: 60217230 (1985-10-01), None
patent: 61-206943 (1986-09-01), None
patent: 61-235424 (1986-10-01), None
patent: 05297590 (1993-11-01), None
patent: 06-281801 (1994-10-01), None
patent: 06-316626 (1994-11-01), None
patent: 09003405 (1997-01-01), None
patent: 10219123 (1998-08-01), None
patent: 2000-159860 (2000-06-01), None
patent: 2000-196151 (2000-07-01), None
patent: 2000-292920 (2000-10-01), None
patent: 2000-344868 (2000-12-01), None
patent: 2001019721 (2001-01-01), None
patent: 2001-040022 (2001-02-01), None
patent: 2001-081416 (2001-03-01), None
patent: 2001-272775 (2001-10-01), None
patent: 2001-323135 (2001-11-01), None
patent: 2003-255120 (2003-09-01), None
patent: 2006-131867 (2006-05-01), None
patent: WO 9324569 (1993-12-01), None
Naugard 445 product data sheet, D-Bond Trading Co., Ltd., 2010, one page.
Tinuvin 144 product data sheet, Ciba Specialty Chemicals, 2010, three pages.
Tinuvin 900 product data sheet, Ciba Specialty Chemicals, 2010, three pages.
CAPLUS accession Nos. 1960:59714 for Netherlands Patent No. 90245, Feb. 1959 and 1957:95365 for equivalent Great Britain Patent No. 781,416, Aug. 1957.
Chemical abstracts registry No. 123-28-4 for dilauryl 3,3′-thiodipropionate, 1997, 2 pages.
Chemical abstracts registry No. 2082-79-3 for ADK Stab AO 50, 1997, 2 pages.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Encapsulant of epoxy group-containing (meth)acrylic polymer,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Encapsulant of epoxy group-containing (meth)acrylic polymer,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Encapsulant of epoxy group-containing (meth)acrylic polymer,... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2631215

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.