Encapsulant of crystalline epoxy resin and phenolic resin-crysta

Details Encapsulant of crystalline epoxy resin and phenolic resin-crysta Encapsulant of crystalline epoxy resin and phenolic resin-crysta

1998-01-14

2000-02-22

Sellers, Robert E.

Stock material or miscellaneous articles

Composite

Of epoxy ether

523427, 525489, B32B 2738, C08K 336, C08L 6302

Patent

active

060278129

ABSTRACT:
An epoxy resin composition comprising a crystalline epoxy resin, a phenolic resin, and an inorganic filler is improved in moldability by previously reacting phenolic hydroxyl groups on the phenolic resin with epoxy groups on the crystalline epoxy resin to form a reaction product and blending the reaction product in the composition. The composition is moldable over semiconductor devices without voids and wire flow. The encapsulated semiconductor devices thus remain reliable.

REFERENCES:
patent: 5623031 (1997-04-01), Imura et al.

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