Encapsulant materials and associated devices

Details Encapsulant materials and associated devices Encapsulant materials and associated devices

2011-03-08

2011-03-08

Choi, Ling-Siu (Department: 1762)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C525S326100, C525S387000, C525S328300, C136S251000, C136S259000

Reexamination Certificate

active

07902301

ABSTRACT:
Compositions suitable for use as encapsulants are described. The inventive compositions include a high molecular weight polymeric material, a curing agent, an inorganic compound, and a coupling agent. Optional elements include adhesion promoting agents, colorants, antioxidants, and UV absorbers. The compositions have desirable diffusivity properties, making them suitable for use in devices in which a substantial blocking of moisture ingress is desired, such as photovoltaic (PV) modules.

REFERENCES:
patent: 4385136 (1983-05-01), Ancker et al.
patent: 4550056 (1985-10-01), Pickwell et al.
patent: 4587140 (1986-05-01), Johnson
patent: 4601935 (1986-07-01), Metcalf et al.
patent: 4692557 (1987-09-01), Samuelson et al.
patent: 4749430 (1988-06-01), Samuelson et al.
patent: 5916934 (1999-06-01), Mahmud et al.
patent: 6255412 (2001-07-01), Wang et al.
patent: 6323273 (2001-11-01), Mahmud et al.
patent: 6777610 (2004-08-01), Yamada et al.
patent: 6785360 (2004-08-01), Annis
patent: 2002/0029799 (2002-03-01), Yoda et al.
patent: 2003/0114350 (2003-06-01), Schmitt et al.
patent: 2003/0184257 (2003-10-01), Nomura et al.
patent: 2004/0028909 (2004-02-01), Hodgson et al.
patent: 2004/0059069 (2004-03-01), Grimm et al.
patent: 2004/0084078 (2004-05-01), Yoshida et al.
patent: 2004/0244316 (2004-12-01), Macuga et al.
patent: 2006/0201544 (2006-09-01), Inoue
patent: 1035591 (2000-09-01), None
patent: 1 837 372 (2007-09-01), None
patent: 1837372 (2007-09-01), None
patent: 60-092379 (1985-05-01), None
patent: 60-250084 (1985-12-01), None
patent: 01-265408 (1989-10-01), None
patent: 01265408 (1989-10-01), None
patent: 09-298013 (1997-11-01), None
patent: 11-217463 (1999-08-01), None
patent: WO 2006093936 (2006-09-01), None
M.D. Kempe, G.J. Jorgensen, K.M. Terwilliger, T.J. McMahon, C.E. Kennedy, T.T. Borek, Acetic acid production and glass transition concerns with ethylene-vinyl acetate used in photovoltaic devices, Solar Energy Materials & Solar Cells, 2007, 91:315-329.
G.J. Jorgensen, K.M. Terwilliger, J.A. Delcueto, S.H. Glick, M.D. Kempe, J.W. Pankow, F.J. Pern, T. J. McMahon, Solar Energy Materials & Solar Cells, 2006, 90:2739-2775.
M.D. Kempe, Modeling of rates of moisture ingress into photovoltaic modules, Solar Energy Materials & Solar Cells, 2006, 90:2720-2738.
M.D. Kempe, Control of moisture ingress into photovoltaic modules, 31st IEEE-PVSC, Lake Buena Vista, FL, Jan. 3-7, 2005.
N.G. Dhere, Reliability of PV modules and balance-of-system components, 31st IEEE-PVSC, Lake Buena Vista, FL, Jan. 3-7, 2005.
M.D. Kempe, Rheological and mechanical considerations for photovoltaic encapsulants, 2005 DOE Solar Energy Technologies Program Review Meeting, Denver, CO, Nov. 7-10, 2005.
M.D. Kempe, Module encapsulant diagnostic and modeling, 2004 DOE Solar Energy Technologies Program Review Meeting, Denver, CO, Oct. 25-28, 2004.

Affiliated with

Also associated with

Rating

Encapsulant materials and associated devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Encapsulant materials and associated devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Encapsulant materials and associated devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2711661