Encapsulant composition and electronic package utilizing same

Details Encapsulant composition and electronic package utilizing same Encapsulant composition and electronic package utilizing same

2008-01-22

2008-01-22

Sellers, Robert (Department: 1712)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

C257S793000, C438S127000, C523S443000, C524S544000, C524S560000, C524S567000, C524S571000, C524S574000, C524S575000, C524S577000, C524S578000, C524S579000, C524S588000, C524S590000, C524S601000, C524S606000, C524S609000, C524S611000, C524S612000, C525S390000, C525S396000, C525S507000, C525S524000

Reexamination Certificate

active

11687997

ABSTRACT:
A method of making an encapsulant composition. The method includes: providing a first quantity of resin material of epoxy or cyanate ester resins; adding to the first quantity of resin material a second quantity of flexibilizing agent; adding to the first quantity of resin material a third quantity of filler material; blending the resin material. After adding the flexibilizing agent, adding the filler material, and blending the resin material, applying the composition to a gap between a substrate and a semiconductor chip. After applying the composition to the gap, pregelling the composition. After pregelling the composition, substantially curing the composition.

REFERENCES:
patent: 2890194 (1959-06-01), McGary, Jr. et al.
patent: 2890197 (1959-06-01), McGary, Jr. et al.
patent: 3207357 (1965-09-01), Schmitt
patent: 3401126 (1968-09-01), Miller et al.
patent: 3429040 (1969-02-01), Miller
patent: 3553244 (1971-01-01), Grigat et al.
patent: 3681292 (1972-08-01), Loudas et al.
patent: 3740348 (1973-06-01), Grigat et al.
patent: 3755402 (1973-08-01), Grigat et al.
patent: 4195132 (1980-03-01), Sundermann et al.
patent: 4294746 (1981-10-01), Blair et al.
patent: 4477629 (1984-10-01), Hefner, Jr.
patent: 4546131 (1985-10-01), Hefner, Jr.
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4740584 (1988-04-01), Shimp
patent: 4745215 (1988-05-01), Cox et al.
patent: 4999699 (1991-03-01), Christie et al.
patent: 5089440 (1992-02-01), Christie et al.
patent: 5194930 (1993-03-01), Papathomas et al.
patent: 5225484 (1993-07-01), Shiobara et al.
patent: 5250600 (1993-10-01), Nguyen et al.
patent: 5250848 (1993-10-01), Christie et al.
patent: 5668059 (1997-09-01), Christie et al.
patent: 5668904 (1997-09-01), Sutherland et al.
patent: 5698904 (1997-12-01), Tsuji
patent: 5766670 (1998-06-01), Arldt et al.
patent: 5981313 (1999-11-01), Tanaka
patent: 5982631 (1999-11-01), Bowles et al.
patent: 6057402 (2000-05-01), Zhou et al.
patent: 6090474 (2000-07-01), Johansson et al.
patent: 6121358 (2000-09-01), Dershem et al.
patent: 6376100 (2002-04-01), Shiobara et al.
patent: 6444407 (2002-09-01), Day et al.
patent: 6790473 (2004-09-01), Papathomas et al.
patent: 6794040 (2004-09-01), Johansson et al.
patent: 2611796 (1976-10-01), None
patent: 4223632 (1994-01-01), None
patent: 0147548 (1984-10-01), None
patent: 0650504 (1995-05-01), None
patent: 07-268278 (1995-10-01), None
patent: 09-040747 (1997-02-01), None
patent: 09-059349 (1997-03-01), None
patent: 2000-248158 (2000-09-01), None
Chemical abstracts registry No. 9002-93-1 for Triton X-100 or polyethylene glycol p-tert-octylphenyl ether, 1967.
CAPLUS accession No. 1997:713725 for the Materials Research Society Symposium Proceedings article by Shi et al. entitled “Composite materials with adjustable thermal expansion for electronic applications,” vol. 445, abstract.
Spaulding, et al.; Coating Material; IBM Technical Disclosure Bulletin, vol. 13, No. 4, Sep. 1970; p. 825.
Brydson, J. A.; Plastics Materials; 1996; p. 471.
Clagett, Donald C.; Engineering Plastics; Encyclopedia of Polymer Science and Engineering, John Wiley and Sons, Final Edition (title pg., copyright pg., and Table of Contents pg.), 1986.
Cycloaliphatic Epoxide systems; Union Carbide Corporation; 1970.

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