Encapsulant composition and electronic package utilizing same

Details Encapsulant composition and electronic package utilizing same Encapsulant composition and electronic package utilizing same

2007-03-20

2007-03-20

Sellers, Robert (Department: 1712)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

C257S793000, C523S443000, C524S544000, C524S560000, C524S567000, C524S571000, C524S574000, C524S575000, C524S577000, C524S578000, C524S579000, C524S588000, C524S590000, C524S601000, C524S606000, C524S609000, C524S611000, C524S612000, C525S390000, C525S396000, C525S507000, C525S524000

Reexamination Certificate

active

09778996

ABSTRACT:
A composition for use in making an encapsulant usable in the encapsulation of a semiconductor chip assembled to a substrate with C4 solder interconnections therebetween, which in turn may form part of an electronic package. The composition comprises a resin, a flexibilizing agent and a filler material.

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