Electric lamp or space discharge component or device manufacturi – Process – With assembly or disassembly
Reexamination Certificate
2007-02-07
2010-10-26
Williams, Joseph L (Department: 2889)
Electric lamp or space discharge component or device manufacturi
Process
With assembly or disassembly
C427S069000, C313S506000
Reexamination Certificate
active
07819717
ABSTRACT:
A process for producing an emissive device that includes (1) feeding the first material to the first region and the third region and to a side adjacent to a first face of at least one first electrode by a gas-phase process with a first mask to form films; (2) feeding the second material to the second region and the third region such that the second material fed in the third region is stacked above the first material in the third region and to the side adjacent to the first face of each first electrode by a gas-phase process to form the emissive layers; and (3) forming a second electrode at a side of each emissive layer opposite the side adjacent to the first electrode.
REFERENCES:
patent: 6872472 (2005-03-01), Liao et al.
patent: 7304700 (2007-12-01), Park et al.
patent: 2006/0238118 (2006-10-01), Spindler
patent: 2006/0238119 (2006-10-01), Spindler
patent: 2007/0046195 (2007-03-01), Chin et al.
patent: 2007/0200495 (2007-08-01), Kai et al.
patent: A 8-227276 (1996-09-01), None
patent: A-10-3990 (1998-01-01), None
patent: A 2000-91082 (2000-03-01), None
patent: A-2007-234268 (2007-09-01), None
Hosoda Toshiko
Yotsuya Shinichi
Coughlin Andrew J
Oliff & Berridg,e PLC
Seiko Epson Corporation
Williams Joseph L
LandOfFree
Emissive device, process for producing emissive device, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Emissive device, process for producing emissive device, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Emissive device, process for producing emissive device, and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4168713