EMI shielding for imager devices

Details EMI shielding for imager devices EMI shielding for imager devices

2007-12-28

2009-11-24

Nguyen, Cuong Q (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S431000, C257S432000, C257S098000, C257S686000, C257S777000, C257SE31117, C257SE31127

Reexamination Certificate

active

07622786

ABSTRACT:
A module that provides EMI shielding for imager devices is disclosed which includes a die comprising an imager device and a plurality of contact pads, a stack positioned above the imager device, the stack comprising at least one lens, a conductive layer positioned above the stack, the conductive layer comprising at least one light opening, and a plurality of wire bonds, each of which conductively couples the conductive layer to one of the contact pads on the die. A method of providing EMI shielding for an imager module is also disclosed which includes conductively coupling a conductive layer of the module to a plurality of contact pads on an imager die and forming an encapsulant material that encapsulates at least the plurality of wire bonds, the conductive layer and the contact pads.

REFERENCES:
patent: 2005/0019986 (2005-01-01), Pike et al.
patent: 2005/0046003 (2005-03-01), Tsai
patent: 2005/0161587 (2005-07-01), Mihara et al.

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