EMI shielding for electronic component packaging

Details EMI shielding for electronic component packaging EMI shielding for electronic component packaging

2006-09-19

2006-09-19

Reichard, Dean A. (Department: 2831)

Electricity: conductors and insulators

Anti-inductive structures

Conductor transposition

C361S752000, C361S753000, C174S522000

Reexamination Certificate

active

07109410

ABSTRACT:
The present invention provides methods and devices for shielding an electronic component package. In one embodiment, an EMI shield is integrally formed within the package adjacent the die and grounded. The EMI shield may be a metallized shaped polymer layer and may be disposed fully within the package or it may extend out of the package.

REFERENCES:
patent: 4814943 (1989-03-01), Okuaki
patent: 5355016 (1994-10-01), Swirbel et al.
patent: 5394304 (1995-02-01), Jones
patent: 5468910 (1995-11-01), Knapp et al.
patent: 5559306 (1996-09-01), Mahulikar
patent: 5594204 (1997-01-01), Taylor et al.
patent: 5639989 (1997-06-01), Higgins
patent: 5677511 (1997-10-01), Taylor et al.
patent: 5811050 (1998-09-01), Gabower et al.
patent: 6566596 (2003-05-01), Askew
patent: 6596937 (2003-07-01), Mazurkiewicz
patent: 6614102 (2003-09-01), Hoffman et al.
patent: 6624353 (2003-09-01), Gabower
patent: 6643918 (2003-11-01), Ortiz et al.
patent: 6686649 (2004-02-01), Mathews
patent: 6717485 (2004-04-01), Kolb et al.
patent: 6768654 (2004-07-01), Arnold et al.
patent: 2001/0033478 (2001-10-01), Ortiz et al.
patent: WO 01/28305 (2001-04-01), None
U.S. Appl. No. 09/685,969, filed Oct. 10, 2000, Janik et al.
Fujitsu Microelectronics America, Inc., “The Possibilities are Infinite Fujitsu: ASIC Packaging,” product information (2002).
Sato, S. et al., “2nd Level Interconnect Reliability of Ceramic Area Array Packages,” presented at Semicon Taiwan (Sep. 23, 1997).

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