EMI shielding and thermal management assemblies including...

Details EMI shielding and thermal management assemblies including... EMI shielding and thermal management assemblies including...

2006-05-25

2009-11-24

Bui, Hung S (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S818000, C361S800000

Reexamination Certificate

active

07623360

ABSTRACT:
According to various aspects of the present disclosure, exemplary embodiments are of assemblies capable of providing board level EMI shielding and heat dissipation of one or more electrical components. Other aspects relate to components of such assemblies. Further aspects relate to methods of using EMI shielding and thermal management assemblies. Additional aspects relate to methods of making EMI shielding and thermal management assemblies, and methods of making the components thereof.

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Heat Sink Shield, 13 pages of drawings.

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