EMI shielded semiconductor package

Details EMI shielded semiconductor package EMI shielded semiconductor package

2007-06-15

2009-08-18

Menz, Douglas M (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

C257S660000

Reexamination Certificate

active

07576415

ABSTRACT:
An EMI shielded semiconductor package is provided. The package includes a substrate and a chip disposed on the substrate. The chip is electrically connected to the substrate by a plurality of bonding wires. At least one shielding conductive block is formed on the substrate and electrically connected to the ground trace of the substrate. A sealant is formed on the substrate and covers the chip, bonding wires and the shielding conductive block. The sealant has a side surface to expose a surface of the shielding conductive block. A layer of conductive film is formed on the outer surface of the sealant and covers the exposed surface of the shielding conductive block thereby shielding the chip from electromagnetic interference.

REFERENCES:
patent: 6614102 (2003-09-01), Hoffman et al.
patent: 6740959 (2004-05-01), Alcoe et al.
patent: 6781231 (2004-08-01), Minervini
patent: 6865084 (2005-03-01), Lin et al.
patent: 7030469 (2006-04-01), Mahadevan et al.
patent: 2004/0150097 (2004-08-01), Gaynes et al.

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