EMI shield, and assembly using same

Details EMI shield, and assembly using same EMI shield, and assembly using same

1993-11-22

1994-10-18

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

24458, 174 35R, 174 51, 248510, 257718, 361704, 439607, H05K 720

Patent

active

053574044

ABSTRACT:
The assembly of an electronic package, a socket which holds the package, an electrically-conductive heat sink placed over and around the package, and an EMI shield for minimizing EMI leakage. The shield is a metal frame extending around the socket and package, and secured to it by locking tabs extending inwardly from the frame to detents on the edges of the socket. The socket contains double-wall structures spaced along its periphery which support the frame when it is on the socket, and the heat sink is provided with depending skirts which extend downwardly on all sides of the socket and package, to contribute additional EMI shielding. The sink is held to the socket by resilient retainers, each secured at one end to an upper surface of the heat sink and extending downwardly through the heat sink to be releasably secured to latching detents on the edges of the socket, by means of latches located inside the frame. The double-wall structures hold the frame outward from the latching detents sufficiently that the latches of the retainer fit between the edges of the socket and the inside of the frame.

REFERENCES:
patent: Re32370 (1987-03-01), Bright et al.
patent: 3775552 (1973-11-01), Schumacher
patent: 4404617 (1983-09-01), Ohyama
patent: 4716494 (1987-12-01), Bright et al.
patent: 4745456 (1988-05-01), Clemens
patent: 4822286 (1989-04-01), Bianca
patent: 4841414 (1989-06-01), Hibino et al.
patent: 4846727 (1989-07-01), Glover
patent: 4867690 (1989-09-01), Thumma
patent: 4890199 (1989-12-01), Beutler
patent: 4901205 (1990-02-01), Landis et al.
patent: 4926291 (1990-05-01), Sarraf
patent: 4988310 (1991-01-01), Bright et al.
patent: 5014160 (1991-07-01), McCoy, Jr.
patent: 5030115 (1991-07-01), Regnier et al.
patent: 5031028 (1991-07-01), Galich et al.
patent: 5053924 (1991-10-01), Kurgan
patent: 5124889 (1992-06-01), Humbert et al.
patent: 5241453 (1993-08-01), Bright et al.
High Speed-Dissipators, IERI, Thermal Management Products, Bull No. 503, Mar. 1991.
High Speed Microprocessor Heat Dissipators, IERC; Burbank, Calif.; Mar. 1991.

Affiliated with

Also associated with

Rating

EMI shield, and assembly using same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with EMI shield, and assembly using same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and EMI shield, and assembly using same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2376827