EMI shield and a method of forming the same

Details EMI shield and a method of forming the same EMI shield and a method of forming the same

1996-08-27

1999-08-31

Thibodeau, Paul

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Physical dimension specified

4284231, 4284258, 428461, 428469, B32B 516, B32B 2700

Patent

active

059452137

ABSTRACT:
Improved shield against electromagnetic interference comprises an undercoat formed on at least one surface of a nonconductive substrate comprising a jacket or case of electronic equipment or part thereof that are vulnerable to electromagnetic interference and a metal layer formed over said undercoat; said undercoat is composed of 10-60 wt % of a composite metal oxide hydrate and 40-90 wt % of a binder and said metal layer is formed by electroless plating of copper and/or nickel.

REFERENCES:
patent: 3657003 (1972-04-01), Kenney
patent: 4517118 (1985-05-01), Stoetzer
patent: 4663240 (1987-05-01), Hajdu et al.
patent: 5076841 (1991-12-01), Chen et al.
patent: 5399432 (1995-03-01), Schleifstein et al.
patent: 5603983 (1997-02-01), Clough et al.

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