EMI/RFI sealed microphonics isolation apparatus and methods

Details EMI/RFI sealed microphonics isolation apparatus and methods EMI/RFI sealed microphonics isolation apparatus and methods

1988-06-08

1989-05-16

Askin, Laramie E.

Electricity: conductors and insulators

Anti-inductive structures

Conductor transposition

174 521, 331 67, 331 68, H05K 900, H05K 504

Patent

active

048312118

ABSTRACT:
A conductive and mechanical energy absorbing gasket is used between an electronics package and a cover of an enclosure to provide microphonics isolation. The electronics package is secured to the cover via a gasket using isolation damping grommets and screws, so that the only substantial transmission of mechanical energy from the case to the electronic package is through the screws themselves. The conductivity of the gasket places the entire enclosure at the same potential as the metal in the electronic package and as the mounting screws, and thus helps prevent the screws from acting as RF antennas.

REFERENCES:
patent: 4091232 (1978-05-01), Lenk et al.

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