Electricity: conductors and insulators – Anti-inductive structures – Conductor transposition
Patent
1992-12-18
1994-05-31
Picard, Leo P.
Electricity: conductors and insulators
Anti-inductive structures
Conductor transposition
429 95, 429 96, 429108, 429271, 429927, 29884, H05K 900, H01R 4300, H01R 466, H01R 1352
Patent
active
053171055
ABSTRACT:
An EMI/RFI gasket provides a barrier to EMI and RFI radiation transmission to and from electronic circuits within an electronic system chassis having receptacles that receive electrical connectors and an electrically grounded cover plate that connects the chassis to an electrical ground. The EMI/RFI gasket helps to provide a 360.degree. EMI/RFI barrier for the electronic system chassis. The EMI/RFI gasket is a flexible, electrically-conductive material with sufficient surface area to adhere and electrically connect to the cover plate. The EMI/RFI gasket has a receiving slot that is symmetrical about a longitudinal axis and a latitudinal axis of the gasket plate. A plurality of deflected teeth formed from the gasket plate are positioned around the receiving slot and deflected from the gasket plate to contact the connector at points separated by not greater than a predetermined distance. The predetermined distance is at least in part a function of the expected EMI and RFI radiation wavelengths. This maintains an electrical ground connection between the cover plate and the connector.
REFERENCES:
patent: 2783295 (1957-02-01), Ewing
patent: 4386814 (1983-06-01), Asick
patent: 4688868 (1987-08-01), Noyes
patent: 4767345 (1988-08-01), Gutter et al.
Alcatel Network Systems, Inc.
Kraft Dennis O.
Ledynh Bot L.
Lutz Bruce C.
Picard Leo P.
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