EMI protection and CTE control of three-dimensional circuitized

Electricity: conductors and insulators – Anti-inductive structures – Conductor transposition

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Details

174 35C, 174255, 174252, H05K 900

Patent

active

059293756

ABSTRACT:
A circuit board includes a substantially non-conductive substrate and first and second rigid sheets. The first sheet forms a grid pattern substantially encapsulated by the substrate, and a portion of the first sheet extends beyond a boundary of the substrate to form a first interconnection terminal. The second sheet is also substantially encapsulated by the substrate and has a portion which extends beyond the boundary of the substrate to form a second interconnection terminal. The second sheet acts as an electromagnetic interference shield, and also has a coefficient of thermal expansion less than a coefficient of thermal expansion of the substrate.

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