EMI containment for microprocessor core mounted on a card using

Details EMI containment for microprocessor core mounted on a card using EMI containment for microprocessor core mounted on a card using

1998-06-17

2000-03-28

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 35GC, 174 51, 361715, 361753, 361816, H05K 720, H05K 900

Patent

active

060439831

ABSTRACT:
An electronic cartridge which includes a cover that is electrically coupled to a substrate by a clip. An integrated circuit package is mounted to the substrate and at least partially enclosed by the cover. The clips and cover may be connected to a ground plane of the substrate. The cover and substrate may create a "shield" about the integrated circuit package so that any electro-magnetic field that flows from the package is grounded to the substrate.

REFERENCES:
patent: 5541811 (1996-07-01), Henningsson et al.
patent: 5546278 (1996-08-01), Bethurum
patent: 5615085 (1997-03-01), Wakabayashi et al.
patent: 5659459 (1997-08-01), Wakabayashi et al.

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