EMF shielding of an integrated circuit package

Details EMF shielding of an integrated circuit package EMF shielding of an integrated circuit package

1994-05-26

1996-01-23

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

257706, 257707, 257713, 257723, 257725, 257796, H01L 2306, H01L 2336, H01L 23482

Patent

active

054867207

ABSTRACT:
A package for housing integrated circuit chips that provides EMF shielding and thermal protection, while conforming to an industry recognized package outline, is provided. This EMF shielding and thermal protection is achieved by providing an electrically conductive heat sink that provides heat dissipation and that, together with a separate electrically conductive layer, also acts as an EMF shield. The heat sink contains a recess and is positioned against the conductive layer with the recess facing the conductive layer. The integrated circuit (IC) resides inside the cavity formed by the heat sink and conductive layer and is protected from EMF by the heat sink and conductive layer. The heat sink, electrically conductive layer and IC are then encapsulated in an electrically insulating molding compound that is molded to an industry recognized package outline. Additional ICs can be housed in this package by attaching them to the side of the electrically conductive layer opposite the heat sink. These additional ICs are protected from EMF emanating from the IC that is housed inside the cavity. This allows for the possibility of housing EMF-generating components and EMF-sensitive components in the same package.

REFERENCES:
patent: 3902148 (1975-08-01), Drees et al.
patent: 4829403 (1989-05-01), Harding
patent: 5172213 (1992-12-01), Zimmerman
patent: 5175613 (1992-12-01), Barker, III et al.
patent: 5184211 (1993-02-01), Fox
patent: 5294826 (1994-03-01), Marcantonio et al.
patent: 5317107 (1994-05-01), Osorio
patent: 5371404 (1994-12-01), Juskey et al.

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