Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-01-10
2006-01-10
Cuneo, Kamand (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S816000, C361S818000
Reexamination Certificate
active
06985366
ABSTRACT:
An EMC shield is provided for electronic components on a printed circuit board, which has a housing which surrounds the electronic components at least on the sides not facing the printed circuit board and shields them against electromagnetic radiation, with the housing having a number of electrically conductive spring contacts which make electrically conductive contact with the printed circuit board, and the housing being pressed against the printed circuit board by means of at least one pressure contact-making device.
REFERENCES:
patent: 4754101 (1988-06-01), Stickney et al.
patent: 5748449 (1998-05-01), Tahmassebpur
patent: 5907478 (1999-05-01), Watanabe
patent: 6137692 (2000-10-01), Venant
patent: 6469906 (2002-10-01), Baltz et al.
patent: 6490173 (2002-12-01), Perkins et al.
patent: 6649827 (2003-11-01), West et al.
patent: 2003/0218873 (2003-11-01), Eromaki et al.
patent: 2004/0062020 (2004-04-01), Leung et al.
patent: 35 20 531 (1986-12-01), None
patent: 3520531 (1986-12-01), None
patent: 41 37 112 (1993-05-01), None
patent: 43 17 469 (1994-12-01), None
patent: 4317469 (1994-12-01), None
patent: 29713412 (1997-09-01), None
patent: 297 13 412 (1997-11-01), None
patent: 198 40 234 (2000-09-01), None
patent: 199 56 184 (2001-06-01), None
Derwent Abstract, DE29713412, Sep. 25, 1997; Siemens AG, D-80333 München.
Derwent Abstract, DE3520531, Dec. 11, 1986; Hagenuk GmbH, D-2300 Kiel.
Derwent Abstract, DE19840234, Sep. 7, 2000; Siemens AG, D-80333 München.
Derwent Abstract, DE4317469, Dec. 1, 1994; Robert Bosch GmbH, D-70469 Stuttgart.
Derwent Abstract, DE19956184, Jun. 21, 2001; IAD Gesellschaft für Informatik, D-90613 Grosshabersdorf.
Derwent Abstract, DE4137112, May 13,1993; Bayerische Motoren Werke AG, D-8000 München.
Albayrak Goekhan
Miethig Werner
Ulmer Patrick
Cuneo Kamand
Eisenberg Jacob
Semenenko Yuriy
Siemens Aktiengesellschaft
Siemens AG
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