Embossing system to be used with a die press

Details Embossing system to be used with a die press Embossing system to be used with a die press

2006-02-07

2006-02-07

Yan, Ren (Department: 2854)

Printing

Embossing or penetrating

Special-article machines

C101S028000

Reexamination Certificate

active

06994024

ABSTRACT:
Disclosed is an embossing system to be used with a die press. The embossing system includes a force transfer assembly, which comprises a first cover and an opposite second cover with the first and second covers being connected by a hinge. The force transfer assembly further includes a stencil and an opposing form positioned internal of the force transfer assembly. The stencil and the form are adapted to sandwich an embossing material, such as paper, between the stencil and the form. The embossing system further includes a layer of static vinyl that is located internally of one of the covers to secure the form to the internal side of one of the covers. The embossing system also utilizes an adhesive located on the cover opposite the cover with the vinyl to secure the stencil to the internal side of the opposite cover.

REFERENCES:
patent: 2029567 (1936-02-01), Hough
patent: 4542691 (1985-09-01), Kokrhanek
patent: 4979613 (1990-12-01), McLaughlin et al.
patent: 5181464 (1993-01-01), Kuhlman et al.
patent: 5188026 (1993-02-01), Fuqua et al.
patent: 5590910 (1997-01-01), Meth
patent: 5722319 (1998-03-01), Hirano

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