Embossing printing for fabrication of organic field effect...

Details Embossing printing for fabrication of organic field effect... Embossing printing for fabrication of organic field effect...

2011-05-03

2011-05-03

Lindsay, Jr., Walter L (Department: 2812)

Semiconductor device manufacturing: process

Having organic semiconductive component

C438S082000, C257SE51003, C257SE51005

Reexamination Certificate

active

07935566

ABSTRACT:
A method of fabricating an organic field effect transistor (OFET) includes forming at least one OFET structure by ultraviolet (UV) transfer embossing printing, where, in an example embodiment, the method includes providing ink material on at least part of a patterned surface of a mold, where the mold100is then contacted on a coating of ultraviolet (UV) curable resin on a substrate so as to insert at least part of the ink material into the resin, the resin is then irradiated with UV light, and the mold is separated from the resin so as to transfer the ink material onto the substrate to form at least one OFET structure.

REFERENCES:
patent: 2004/0063267 (2004-04-01), Bernds
patent: 2004/0262599 (2004-12-01), Bernds
patent: 2005/0071969 (2005-04-01), Sirringhaus
patent: 2006/0115998 (2006-06-01), Shin
patent: 2010/0136739 (2010-06-01), Li et al.
patent: 2004006291 (2004-01-01), None
patent: 2004111729 (2004-12-01), None
Gunther Leising, et al., “Nanoimprinted devices for intergrated organic electronics”, Microelectronic Engineering 83 (2006) 831-838.
International Search Report PCT/SG2008/000185 Dated Jul. 30, 2008.

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