Embossing method and apparatus

Details Embossing method and apparatus Embossing method and apparatus

2003-05-13

2010-11-02

Tucker, Philip C (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S230000, C264S284000, C264S293000, C427S372200, C716S030000

Reexamination Certificate

active

07824516

ABSTRACT:
A method and apparatus for forming a patterned layer having a surface profile that provides relief structures within an electronic device. The method comprises the steps of taking a carrier film (50) having an inverse of the required surface profile formed on one side thereof, taking a layer of fixable material (54) located on a substrate (52), laminating the carrier film (50) and substrate (52) such the carrier film causes the required surface profile to be formed in the layer of fixable material with a predetermined offset, and then fixing the fixable material. Lamination may be performed using rollers (56,58) or a vacuum process. The process is designed to ensure that the offset can be kept as low as possible, preferably to within 150 nm.

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