Embossing cylinder

Printing – Embossing or penetrating – Die members

Patent

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Details

101 16, 101 22, 4001342, B31F 107

Patent

active

060621346

DESCRIPTION:

BRIEF SUMMARY
The invention relates to an embossing cylinder according to the preamble of claim 1.
The object of the invention is to provide an embossing cylinder.
Preferably, the stamping dies can be changed individually. With this possibility, one can avoid to change an expensive stamping ring with a great number of stamping dies. It is particularly advantageous that the stamping dies can be adjusted individually. Hence the stamping dies can be individually adapted to the deformation occurring on the material to be embossed, for example sheets of paper. This adjustment possibility of the stamping dies is particularly advantageous with hot stamping cylinders, with which a sample of a hot stamping foil is applied on a paper sheet. With these paper sheets, there is a particularly high risk that a deformation appears on the paper due to high mechanical pressure load with the simultaneous influence of heat.
A dovetail-shaped guiding for the stamping dies allows an easy adjustment or exchange and is simple and inexpensive to build.
The embossing cylinder according to the invention is represented in the drawings and is described in more detail in the following:
FIG. 1 shows a schematical side view of the embossing cylinder;
FIG. 2 shows a schematical top view of a cut-out if the embossing cylinder;
FIG. 3 shows a schematical cut through an stamping die of an embossing cylinder.
An embossing cylinder 1, in particular a hot stamping cylinder 1 for a rotational hot stamping of samples of a foil on a paper sheet or a paper web in an stamping machine is provided with at least a supporting ring 2 for supporting stamping dies 3. In the axial direction of the hot embossing cylinder 1, a plurality of said supporting rings 2 can be placed on the hot embossing cylinder one next to the other. The supporting ring 2 comprises, in cross section, a H-shaped profile extending along the circumferential direction of the hot embossing cylinder 1. An inner diameter d2, for example d2=550 mm, of the supporting ring 2 corresponds to an outer diameter D1, for example D1=600 mm, of the hot embossing cylinder, so that the supporting ring 2 is movable, when the hot embossing cylinder 1 is not heated.
In a first U-shaped groove 6 of the supporting ring 2, which is turned towards the circumferential surface 4 of the hot embossing cylinder 1, electrically heated heating elements 7 are placed. A second U-shaped groove 8 of the supporting ring 2, which is directed towards outside, is limited by two parallel side walls 9, 11 facing each other and by a ground surface 12. This groove 8 comprises in its cross-section a depth t8, for example t8=12,5 mm, and a width b8, for example b8=33 mm, and is, in the present embodiment, formed in an endless rotating manner. In both side walls 9, 11 of said groove 8, a plurality of holes 13 are drilled, which are parallel to the axis of the hot embossing cylinder and perpendicular through the side walls 9, 11, having a diameter d13, for example d13=6 mm. Each one of said holes 13 is extended by a tapping 14. A screw 16 is screwed in the tapping 14. The screws 16 in the left side wall 9 press directly against a first end of a thrust piece 17, for example a pin 17. In the right side wall 11, there is each time a spring 19 between the screw 16 and a thrust piece 18, for example a pin 18, said spring having for example the shape of a stack of disk springs. An end of the pin 17, 18 projects beyond the U-shaped groove 8 wedge-shaped, for example comprises an obliquely extending clamping surface 21. This clamping surface 21 forms an angle alpha, for example alpha=45.degree., with a longitudinal axis 22 of pin 17, 18. Instead of having clamping surfaces 21 build in such a manner, other shapes are possible, such as for example a conical-shaped end of the pins 17,18.
In the U-shaped groove 8, there is at least one stamping die 3. This stamping die 3 has a height h3, for example h3=12,5 mm, and a width b3, for example b3=30 mm. The height h3 of the stamping die 3 is larger than the depth t8 of the U-shaped groove 8 and the width b3 of

REFERENCES:
patent: 2736257 (1956-02-01), Stephenson
patent: 4580492 (1986-04-01), Troyan et al.
patent: 5069122 (1991-12-01), Kaufman et al.

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