Embedding a multiwound microcoil in a ceramic structure

Plastic and nonmetallic article shaping or treating: processes – Outside of mold sintering or vitrifying of shaped inorganic... – Simultaneously burning – vaporizing – or melting of embedded...

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Details

264619, 427105, 427116, B28B 138

Patent

active

058041303

ABSTRACT:
A method for forming an embedded multiwound microcoil in a ceramic substrate including the steps of forming a sacrificial mutiwound microcoil to be used in the ceramic substrate by wrapping a first sacrificial coil winding about the midsection of a sintered ceramic bar thereby forming a one winding sacrificial coil structure; dipping the one winding sacrificial coil structure in a sol-gel precursor and then forming an encapsulated one winding sacrificial coil structure from such sol-gel precursor; wrapping a second sacrificial coil winding about the midsection of the encapsulated one winding sacrificial coil structure thereby forming a two winding sacrificial coil structure. The method further includes incorporating the multiwound sacrificial coil structure into a green ceramic substrate; sintering the green ceramic substrate at a sufficient temperature to burn away the sacrificial coil windings thereby forming an embedded coil receiving cavity; flowing molten electrically conductive material into the embedded coil receiving cavity; and cooling the molten electrically conductive material to form the multiwound microcoil embedded in a ceramic substrate.

REFERENCES:
patent: 2744839 (1956-05-01), Radley
patent: 5066432 (1991-11-01), Gabathuler et al.
patent: 5423521 (1995-06-01), Stover et al.

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