Metal working – Electric condenser making – Solid dielectric type
Reexamination Certificate
1999-04-14
2001-11-20
Young, Lee (Department: 3729)
Metal working
Electric condenser making
Solid dielectric type
C029S846000, C029S847000, C029S852000, C427S097100
Reexamination Certificate
active
06317948
ABSTRACT:
FIELD OF THE INVENTION
This invention relates to multilevel printed circuit board (MPCB) structures with passive components embedded in interlevel sites in the MPCB.
BACKGROUND OF THE INVENTION
It has been recognized for some time that the density and complexity of interconnections in printed circuit board technology can be increased substantially using multilevel structures. Printed circuits are formed on two or more levels and are interconnected through the board levels using through hole connections or, less typically, with edge connections. Not only is the interconnect density increased for a given board area, but crossovers are substantially simplified.
More recently it has been recognized that further savings in board area can be realized if circuit components as well as interconnects are located in interlevel sites in the MPCB. Typically these devices are thin film passive devices such as resistors, capacitors and inductors. See e.g., T. Lenihan et al, “Embedded Thin Film Resistor, Capacitors and Inductors in Flexible Polyimide Films”, 1996 Electronic Components and Technology Conference (IEEE), pp. 119-124.
A simple and cost effective process for implementing this design concept would represent a significant advance in the technology.
Statement of the Invention
A process has been developed for the manufacture of buried capacitor structures using photolithography and thin film processing. A key to the process is the design of the upper capacitor electrode wherein the upper capacitor electrode terminates short of the edge of the lower capacitor electrode on one side of the capacitor, and extends beyond the lower electrode on the other side of the capacitor, thus allowing through hole interconnections to access the buried electrodes of the capacitor.
REFERENCES:
patent: 4349862 (1982-09-01), Bajorek
patent: 5530288 (1996-06-01), Stone
patent: 5636099 (1997-06-01), Suragawara
patent: 5745334 (1998-04-01), Hoffarth
patent: 5770476 (1998-06-01), Stone
patent: 5972484 (1999-10-01), Cohen
patent: 6005197 (1999-12-01), Kola
Kola Ratnaji Rao
Manzione Louis Thomas
Watts Roderick Kent
Agere Systems Guardian Corp.
Kim Paul D
Wilde Peter V. D.
Young Lee
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