Embedded thin film passive components

Details Embedded thin film passive components Embedded thin film passive components

1997-08-25

1999-12-21

Kincaid, Kristine

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174261, 361761, 361763, H05K 116

Patent

active

060051973

ABSTRACT:
The specification describes of multilevel printed circuit boards and a process for their manufacture in which capacitors and other passive components are buried between levels of the multilevel board. The capacitor in the multilevel structure is designed so that access is conveniently provided to connect from the parallel plate electrodes of the interlevel capacitor to the board surface or to another board level using plated through hole interconnects.

REFERENCES:
patent: 4349862 (1982-09-01), Bajorek et al.
patent: 5530288 (1996-06-01), Stone
patent: 5636099 (1997-06-01), Sugawara et al.
patent: 5745334 (1998-04-01), Hoffarth et al.
patent: 5770476 (1998-06-01), Stone

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