Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-11-01
2008-11-04
Chervinsky, Boris L (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S719000, C361S720000, C165S080300, C257S712000
Reexamination Certificate
active
07447033
ABSTRACT:
A portable computing device includes a housing having an external surface and an inner surface. A solid-state cooling mechanism in the computing device is coupled to the inner surface. This solid-state cooling mechanism is configured to maintain a temperature difference across at least a portion of the external surface that is less than a pre-determined value.
REFERENCES:
patent: 6038128 (2000-03-01), Hood et al.
patent: 6362959 (2002-03-01), Tracy
patent: 6434000 (2002-08-01), Pandolfi
patent: 6525934 (2003-02-01), Nakanishi et al.
patent: 6678168 (2004-01-01), Kenny et al.
patent: 6882536 (2005-04-01), Deeney et al.
patent: 6945312 (2005-09-01), Czubarow et al.
patent: 2003/0184941 (2003-10-01), Maeda et al.
patent: 2005/0193742 (2005-09-01), Arnold
patent: 2007/0000642 (2007-01-01), Yamazaki et al.
patent: 2002190687 (2002-07-01), None
patent: 2002278654 (2002-09-01), None
Apple Inc.
Chervinsky Boris L
Park Vaughan & Fleming LLP
Stupp Steven E.
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